"Positivity is the key to life’s lock. Positivity is a key " I said to myself
As I Put on a warm coat, on a Snow-covered Morning in Heisenberg
Hurriedly Rushing out of the building, My hands and legs getting colder. .
Kieth Greeted me with a Warm Smile. As I got out of the Basement,Snow and air hit my face and makes it pale.
An angry face of the professor flashes upon my head .
I reach the classroom within seconds to spare,Sit down and breathe in and out.
In highschool, I was teacher’s pet But in College, U bet ;) . If it was a beautiful, metaphorical life in college you were looking for,
Sorry to disappoint you, but when it comes to the average life Of an original college student we all know
All I want to do is Learn
Not only to learn the Syllabi prescribed by the Higher education board …I want more
Every single Person,except Me is Enjoying the Morning Chill with Friends or Family. . I-Drifting,with a Shuffling feet, running, skipping,sprinting,In a hurry
in boots, in slippers, even barefooted sometimes reaching out to Classroom Cellphone notifications, Alen Texts me" where are you stuck? " I don't even Sigh !! its professor Anderson . . .I remember my Indian Punjabi accent scolding and Smiled . .Finally I reached
I've seen it all on this college campus full of people,Some with high hopes, others just trying to not to get lost in the puzzle …
Students,in their mind. . making up Lame Excuses for Being late to the lecture. . .
Most of the times, those with the apple-pie look are allowed to enter the classroom , those who are tricky-by-face are to be kicked out..
Seems funny :p But its true.
When i started going to Elementary level course of Medical electronics, Alen and me were always together.
Because the lab series was same for both of us.
Our big inspiration,Ms.Anujna.Tandon, our fav Professor who was from a small town In India, held the Lab sessions for GMP analytical chemistry.
She was a university topper in MS, Medical electronics.
Interesting Topic In This Subject : CSP __Chip-scale packaging is emerging as a desirable option for performance-driven small-form-factor medical devices.
Among the many advanced electronics packaging forms introduced during the past few years, chip-scale packaging (CSP) has evolved as an increasingly suitable option for use in performance-driven printed circuit board assembly (PCBA) products.
The past years could even be called the CSP revolution, reflecting tremendous activity among package developers, potential users, and the assembly providers.
Chip-scale packaging provides PCBA designers and manufacturers with the mainstream assembly infrastructure compatibility and the performance advantages of surface-mount technology (SMT).
Consequently, the medical device industry has now begun to embrace CSP as a desirable electronics package for use in its performance-driven small-form-factor (SFF) PCBA products. However, CSP assembly integration into medical electronics products presents a greater challenge for achieving reliability compliance than it has for commodity products such as personal computers.
CSP Performance Advantages
In contrast to leaded SMT packaging, CSP provides designers with enhanced performance for electrical, thermal, and mechanical characteristics.
CSP uses the same type of interconnect attachment method to the PCBA as the popular—yet physically larger—ball grid array (BGA) packaging.
Since 1993, the electronics packaging and assembly industry has seen BGA packaging evolve into a dependable option that offers increased input/output (I/O) density
and enables a level of assembly robustness far beyond that of the peripheral leaded quad flat packs (QFPs) available at that time.
CSP presents many of the same advantages as BGA packaging It has a common solder ball grid pitching of 1.27 mm,
yet offers a significantly smaller physical size.
The most common CSP solder ball grid pitch is 0.78 mm.
CSP devices are available with pitching down to 0.4 mm, which provides even more I/O density.
This smaller physical size presents appealing prospects for the evolution of SFF medical products, especially in the growing consumer handheld and in-home market segments.
In addition, CSP offers increased electrical performance because of available alternatives to conventional wire-bonded die-attachment methods common for BGA packaging.
These alternative die-attachment options include thermocompression bonding, solder castillation reflow, and solder-bumped flip-chip methods.
Hurriedly Rushing out of the building, My hands and legs getting colder. .
Kieth Greeted me with a Warm Smile. As I got out of the Basement,Snow and air hit my face and makes it pale.
An angry face of the professor flashes upon my head .
I reach the classroom within seconds to spare,Sit down and breathe in and out.
In highschool, I was teacher’s pet But in College, U bet ;) . If it was a beautiful, metaphorical life in college you were looking for,
Sorry to disappoint you, but when it comes to the average life Of an original college student we all know
All I want to do is Learn
Not only to learn the Syllabi prescribed by the Higher education board …I want more
Every single Person,except Me is Enjoying the Morning Chill with Friends or Family. . I-Drifting,with a Shuffling feet, running, skipping,sprinting,In a hurry
in boots, in slippers, even barefooted sometimes reaching out to Classroom Cellphone notifications, Alen Texts me" where are you stuck? " I don't even Sigh !! its professor Anderson . . .I remember my Indian Punjabi accent scolding and Smiled . .Finally I reached
I've seen it all on this college campus full of people,Some with high hopes, others just trying to not to get lost in the puzzle …
Students,in their mind. . making up Lame Excuses for Being late to the lecture. . .
Most of the times, those with the apple-pie look are allowed to enter the classroom , those who are tricky-by-face are to be kicked out..
Seems funny :p But its true.
When i started going to Elementary level course of Medical electronics, Alen and me were always together.
Because the lab series was same for both of us.
Our big inspiration,Ms.Anujna.Tandon, our fav Professor who was from a small town In India, held the Lab sessions for GMP analytical chemistry.
She was a university topper in MS, Medical electronics.
Interesting Topic In This Subject : CSP __Chip-scale packaging is emerging as a desirable option for performance-driven small-form-factor medical devices.
Among the many advanced electronics packaging forms introduced during the past few years, chip-scale packaging (CSP) has evolved as an increasingly suitable option for use in performance-driven printed circuit board assembly (PCBA) products.
The past years could even be called the CSP revolution, reflecting tremendous activity among package developers, potential users, and the assembly providers.
Chip-scale packaging provides PCBA designers and manufacturers with the mainstream assembly infrastructure compatibility and the performance advantages of surface-mount technology (SMT).
Consequently, the medical device industry has now begun to embrace CSP as a desirable electronics package for use in its performance-driven small-form-factor (SFF) PCBA products. However, CSP assembly integration into medical electronics products presents a greater challenge for achieving reliability compliance than it has for commodity products such as personal computers.
CSP uses the same type of interconnect attachment method to the PCBA as the popular—yet physically larger—ball grid array (BGA) packaging.
Since 1993, the electronics packaging and assembly industry has seen BGA packaging evolve into a dependable option that offers increased input/output (I/O) density
and enables a level of assembly robustness far beyond that of the peripheral leaded quad flat packs (QFPs) available at that time.
CSP presents many of the same advantages as BGA packaging It has a common solder ball grid pitching of 1.27 mm,
yet offers a significantly smaller physical size.
The most common CSP solder ball grid pitch is 0.78 mm.
CSP devices are available with pitching down to 0.4 mm, which provides even more I/O density.
This smaller physical size presents appealing prospects for the evolution of SFF medical products, especially in the growing consumer handheld and in-home market segments.
In addition, CSP offers increased electrical performance because of available alternatives to conventional wire-bonded die-attachment methods common for BGA packaging.
These alternative die-attachment options include thermocompression bonding, solder castillation reflow, and solder-bumped flip-chip methods.
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